Anjielo is set to launch a WiFi HaLow bridge designed for the film and television industry.
WiFi HaLow Ethernet Bridge-68086PROJECT DESIGN
1. Product Positioning & Competitive Landscape
The WiFi HaLow Ethernet Bridge is an industrial-grade, long-range wireless bridge built on IEEE 802.11ah (WiFi HaLow) technology. It targets film-set camera control, remote monitoring, and low-bandwidth IoT applications where standard 2.4/5 GHz Wi-Fi fails to deliver reliable range and penetration.
The product is designed to compete directly with established solutions such as , while offering a differentiated feature set: wide-voltage DC input (5–36V), RJ45 Ethernet, and robust industrial construction.
Design conclusion: The product must establish differentiation through wide-voltage input, RJ45 wired access, and industrial-grade protection, while ensuring compliance with European 863–868 MHz and US 902–928 MHz bands.
2. Hardware Design
2.1 Core Chipset Selection
Recommended · Morse Micro MM8108
- Modulation 256-QAM, up to 43.33 Mbps
- PA Integration 26 dBm integrated PA
- Footprint Smallest in class
- Certification Global compliance ready
Alternative · Newracom NRC7394
- Ecosystem Mature, modules from Murata/Teledatics
- Performance Proven reliability
- Cost Competitive BOM
- Availability Broad supply chain
Selection rationale: The MM8108 is the current performance leader among HaLow SoCs, with integrated PA/LNA and no external SAW filter required for global certification. The NRC7394 is retained as a backup for cost optimization or supply chain resilience.
2.2 Power Architecture
- Lemo 2-pin input: 5–36V wide voltage, with reverse-polarity and over-voltage protection.
- USB-C input: 5V only, power only (no data), for field debugging or backup power.
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Status LED: Indicates power presence and system health.
2.3 Network Interface
2.4 RF & Antenna
The top-mounted black circular structure (visible in the 3D model, image 8) is interpreted as an external antenna connector (SMA or N-type), enabling high-gain antennas for extended range.
2.5 Status & Interaction
| Component | Location | Function |
|---|---|---|
| LED indicators (×3 green) | Side panel (image 9) | Power, network status, signal strength |
| Pair / Reset button (orange) | Side panel (images 6, 8) | WPS pairing or factory reset |
3. Mechanical Design
3.1 Enclosure
Form Factor
- Shape Rounded rectangle, industrial aesthetic
- Estimated size 120 × 90 × 45 mm
- Material Aluminum alloy (thermal) or PC+ABS
- Mounting Four corner screw holes (images 7, 10)
Environmental
- Ingress protection IP67 target
- Sealing Gaskets at interfaces and seams
- Operating temp −20°C to +55°C
- Vibration Lemo push-pull locking connector
3.2 Thermal Management
The MM8108 integrates a power amplifier, creating concentrated heat. Thermal design includes:
- Thermal pads transferring heat from the SoC to the enclosure.
- Optional heat-dissipating fins or metallic housing for improved convection.
- Thermal simulation during validation to ensure stability under continuous load.
4. Software Design
Platform
- OS OpenWrt-based
- Modes Bridge, AP, STA
- Pairing Push-button (like Spudnik)
- Management Web UI + CLI
Networking Features
- Transparent bridging Invisible on network
- Throughput 5 Mbps to 1 Mbps adaptive
- Security WPA3 / AES encryption
- Scalability 1 RX to up to 4 TX units
5. Key Risks & Mitigation
| Risk | Impact | Mitigation |
|---|---|---|
| MM8108 supply constraints | Schedule delay | Qualify MM6108 as drop-in alternative |
| Lemo connector cost | Pricing pressure | Evaluate aviation-grade alternative; keep Lemo for premium SKU |
| Global frequency compliance | Market access | Software-switchable bands; regional certification plan |
| Thermal density | Stability | Thermal simulation +导热 pad to enclosure |
